1、Research progress of diamond/metal composites for electronic packaging
2、In this paper, new progress of electronic packaging technology is presented.
3、In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with13 refs.
4、With the development of microelectronic packaging technologies, anisotropic conductive adhesives (ACA) are widely used as one kind of the green materials in the electronic interconnection.
5、The present paper is to cover the actuality of electronic packaging technology in the world and face the lead-free problem in homeland.
