1、If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
2、Ultrasonic wire bonding between Au contact electrode of CdZnTe wafer and down-lead wire
1、If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
2、Ultrasonic wire bonding between Au contact electrode of CdZnTe wafer and down-lead wire